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SD12CT1 Transient Voltage Suppressor
Bi-directional ESD Protection with Ultra Low Clamping Voltage
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The SD12C is designed to protect voltage sensitive components from ESD and transient voltage events. Excellent clamping capability, low leakage, and fast response time, make this part ideal for ESD protection on designs where board space is at a premium. Because of its small size, it is suited for use in cellular phones, portable devices, digital cameras, power supplies and many other portable applications.
Specification Features:
* * * * * * * *
Peak Power - 350 W (8 20 ms) Low Leakage Low Clamping Voltage Small Package for use in Portable Electronics Meets IEC61000-4-2 Level 4 Meets IEC6100-4-4 Level 4 Meets 16 kV Human Body Model ESD Requirements Pb-Free Package is Available
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1 SOD-323 CASE 477 STYLE 1
MARKING DIAGRAM
Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic
Epoxy Meets UL 94, V-0 MOUNTING POSITION: Any
QUALIFIED MAX REFLOW TEMPERATURE: 260C
ZK M G G
Device Meets MSL 1 Requirements Replace the "T1" with "T3" in the Device Number to order the 13 inch/10,000 unit reel.
ZK = Specific Device Code M = Date Code* G = Pb-Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location.
ORDERING INFORMATION
Device SD12CT1 SD12CT1G Package SOD-323 SOD-323 (Pb-Free) Shipping 3000/Tape & Reel 3000/Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2007
1
February, 2007 - Rev. 1
Publication Order Number: SD12CT1/D
SD12CT1
MAXIMUM RATINGS
Rating Peak Power Dissipation @ 20 ms @ TL 25C IEC 61000-4-2 (ESD) IEC 61000-4-4 (EFT) Total Device Dissipation FR-5 Board, (Note 1) @ TA = 25C Derate above 25C Thermal Resistance from Junction-to-Ambient Junction and Storage Temperature Range Lead Solder Temperature - Maximum (10 Second Duration) PD 200 1.5 RqJA TJ, Tstg TL 635 -65 to +150 260 mW mW/C C/W C C Air Contact Symbol Ppk Value 350 30 30 40 Unit W kV A
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Minimum Solder Footprint.
ELECTRICAL CHARACTERISTICS
(TA = 25C unless otherwise noted) Symbol IPP VC VRWM IR VBR IT QVBR Parameter Maximum Reverse Peak Pulse Current Clamping Voltage @ IPP Working Peak Reverse Voltage Maximum Reverse Leakage Current @ VRWM Breakdown Voltage @ IT Test Current Maximum Temperature Variation of VBR IT VC VBR VRWM IR IPP
I
IR V RWM VBR VC IT
V
IPP
Bi-Directional TVS
ELECTRICAL CHARACTERISTICS (TJ = 25C, unless otherwise specified)
Parameter Reverse Working Voltage Breakdown Voltage Reverse Leakage Current Clamping Voltage Additional Clamping Voltage Maximum Peak Pulse Current Capacitance Conditions (Note 2) IT = 1 mA, (Note 3) VRWM = 12 V IPP = 5 A, (8 x 20 msec Waveform) IPP = 15 A, (8 x 20 msec Waveform) 8 x 20 msec Waveform VR = 0 V, f = 1 MHz VR = 12 V, f = 1 MHz Symbol VRWM VBR IR VC IPP Cj 64 36 13.3 1.0 19 24 15 Min Typ Max 12 Unit V V mA V A pF
2. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC or continuous peak operating voltage level. 3. VBR is measured at pulse test current IT.
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2
SD12CT1
PACKAGE DIMENSIONS
SOD-323 CASE 477-02 ISSUE G
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. MILLIMETERS DIM MIN NOM MAX A 0.80 0.90 1.00 A1 0.00 0.05 0.10 A3 0.15 REF b 0.25 0.32 0.4 C 0.089 0.12 0.177 D 1.60 1.70 1.80 E 1.15 1.25 1.35 L 0.08 HE 2.30 2.50 2.70 STYLE 1: PIN 1. CATHODE 2. ANODE INCHES NOM MAX 0.035 0.040 0.002 0.004 0.006 REF 0.010 0.012 0.016 0.003 0.005 0.007 0.062 0.066 0.070 0.045 0.049 0.053 0.003 0.090 0.098 0.105 MIN 0.031 0.000
HE D
b
1
2
E
A3 A L
NOTE 5
C
NOTE 3
A1
SOLDERING FOOTPRINT*
0.63 0.025 0.83 0.033 1.60 0.063 2.85 0.112
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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3
SD12CT1/D

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